3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2014 – 2020

Global 3D IC Market Set for Rapid Growth, To Reach Around USD 8.6 Billion by 2020

The report covers forecast and analysis for the 3D IC market on a global and regional level. The study provides historic data of 2014 along with a forecast from 2015 to 2020 based on revenue (USD million). The study includes drivers and restraints for the 3D IC market along with the impact they have on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the 3D IC market on a global level.

In order to give the users of this report a comprehensive view on the 3D IC market, we have included a detailed value chain analysis. To understand the competitive landscape in the market, an analysis of Porter’s Five Forces model for the 3D IC market has also been included. The study encompasses a market attractiveness analysis, wherein application segments are benchmarked based on their market size, growth rate and general attractiveness.

The study provides a decisive view on the 3D IC market by segmenting the market based on applications. All the application segments have been analyzed based on present and future trends and the market is estimated from 2014 to 2020. Key product market covered under this study includes LED, memories, MEMS, sensor, logic and others. Key product segments covered under this study includes LED, memories, MEMS, sensor, logic and others. Different substrate segments covered under this study includes silicon on insulator and bulk silicon. Major fabrication process segments covered under this study includes silicon epitaxial growth, beam re-crystallization, solid phase crystallization and wafer bonding. Some of the prime application segments covered under this study includes information and communication technology, military, consumer electronics and others applications. The regional segmentation includes the current and forecast demand for North America, Europe, Asia Pacific, Latin America and Middle East & Africa. This segmentation includes demand for 3D IC based on individual applications in all the regions.

The report also includes detailed profiles of end players such as 3M Company, Tezzaron Semiconductor Corporation, United Microelectronics Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, STMicroelectronics and amongst others. The detailed description of players includes parameters such as company overview, financial overview, business strategies and recent developments of the company.

This report segments the global 3D IC market as follows:

3D IC Market:  Product Segment Analysis

  • LED
  • Memories
  • MEMS
  • Sensor
  • Logic
  • Others

3D IC Market:  Substrate Segment Analysis

  • Silicon on Insulator (SOI)
  • Bulk Silicon

3D IC Market:  Fabrication Process Segment Analysis

  • Silicon Epitaxial Growth
  • Beam Re-Crystallization
  • Solid Phase Crystallization
  • Wafer Bonding

3D IC Market:  Application Segment Analysis

  • Information and Communication Technology
  • Military
  • Consumer Electronics
  • Others

3D IC Market: Regional Segment Analysis

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa
  • Chapter 1. Preface
    • 1.1. Report description and scope
    • 1.2. Research scope
    • 1.3. Research methodology
      • 1.3.1. Market research process
      • 1.3.2. Market research methodology
  • Chapter 2. Executive Summary
    • 2.1. Global 3D IC market, 2014 – 2020, (USD Million)
    • 2.2. 3D IC: Market snapshot
  • Chapter 3. 3D IC Market: Industry Analysis
    • 3.1. 3D IC: Market dynamics
    • 3.2. Market Drivers
      • 3.2.1. Growing demand of compact and high performance IC in end-industries
      • 3.2.2. Demand from consumer electronics and ICT industries
    • 3.3. Restraints
      • 3.3.1. High cost and thermal conductivity issues
    • 3.4. Opportunity
      • 3.4.1. emerging IT analytics in Asia Pacific region
    • 3.5. Porter’s Five Forces Analysis
    • 3.6. Market Attractiveness Analysis
      • 3.6.1. Market attractiveness analysis by product segment
      • 3.6.2. Market attractiveness analysis by substrate segment
      • 3.6.3. Market attractiveness analysis by fabrication process segment
      • 3.6.4. Market attractiveness analysis by application segment
      • 3.6.5. Market attractiveness analysis by regional segment
  • Chapter 4. Global 3D IC Market: Competitive Landscape
    • 4.1. Company market share analysis, 2014 (Subject to data availability)
    • 4.2. Price trend analysis
  • Chapter 5. Global 3D IC Market: Product Analysis
    • 5.1. Global 3D IC market share, by product, 2014 & 2020
    • 5.2. Global LED for 3D IC market, 2014 – 2020 (USD Million)
    • 5.3. Global memories for 3D IC market, 2014 – 2020 (USD Million)
    • 5.4. Global MEMS for 3D IC market, 2014 – 2020 (USD Million)
    • 5.5. Global sensor for 3D IC market, 2014 – 2020 (USD Million)
    • 5.6. Global logic for 3D IC market, 2014 – 2020 (USD Million)
    • 5.7. Global others for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 6. Global 3D IC Market: Substrate Type Analysis
    • 6.1. Global 3D IC market share, by substrate type, 2014 & 2020
    • 6.2. Global silicon on insulator (SOI) for 3D IC market, 2014 – 2020 (USD Million)
    • 6.3. Global bulk silicon for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 7. Global 3D IC Market: Fabrication Process Analysis
    • 7.1. Global 3D IC market share, by fabrication process, 2014 & 2020
    • 7.2. Global silicon epitaxial growth for 3D IC market, 2014 – 2020 (USD Million)
    • 7.3. Global beam re-crystallization for 3D IC market, 2014 – 2020 (USD Million)
    • 7.4. Global solid phase crystallization for 3D IC market, 2014 – 2020 (USD Million)
    • 7.5. Global wafer bonding for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 8. Global 3D IC Market: Applications Analysis
    • 8.1. Global 3D IC market share, by application, 2014 and 2020
    • 8.2. Global 3D IC market for information and communication technology, 2014 – 2020 (USD Million)
    • 8.3. Global 3D IC market for military, 2014 – 2020 (USD Million)
    • 8.4. Global 3D IC market for nanotechnology, 2014 – 2020 (USD Million)
    • 8.5. Global 3D IC market for consumer electronics, 2014 – 2020 (USD Million)
    • 8.6. Global 3D IC market for others, 2014 – 2020 (USD Million)
  • Chapter 9. 3D IC Market: Regional Analysis
    • 9.1. Global 3D IC market: Regional overview
      • 9.1.1. Global 3D IC market share, by region, 2014 and 2020
    • 9.2. North America
      • 9.2.1. North America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.2.2. North America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.2.3. North America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.2.4. North America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.3. Europe
      • 9.3.1. Europe 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.3.2. Europe 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.3.3. Europe 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.3.4. Europe 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.4. Asia Pacific
      • 9.4.1. Asia-Pacific 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.4.2. Asia-Pacific 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.4.3. Asia-Pacific 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.4.4. Asia-Pacific 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.5. Latin America
      • 9.5.1. Latin America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.5.2. Latin America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.5.3. Latin America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.5.4. Latin America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.6. Middle East and Africa
      • 9.6.1. Middle East and Africa 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.6.2. Middle East and Africa 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.6.3. Middle East and Africa 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.6.4. Middle East and Africa 3D IC market revenue, by application, 2014 – 2020 (USD Million)
  • Chapter 10. Company Profiles
    • 10.1. 3M Company
      • 10.1.1. Overview
      • 10.1.2. Financials
      • 10.1.3. Product portfolio
      • 10.1.4. Business strategy
      • 10.1.5. Recent developments
    • 10.2. Tezzaron Semiconductor Corporation
      • 10.2.1. Overview
      • 10.2.2. Financials
      • 10.2.3. Product portfolio
      • 10.2.4. Business strategy
      • 10.2.5. Recent developments
    • 10.3. United Microelectronics Corporation
      • 10.3.1. Overview
      • 10.3.2. Financials
      • 10.3.3. Product portfolio
      • 10.3.4. Business strategy
      • 10.3.5. Recent developments
    • 10.4. Samsung
      • 10.4.1. Overview
      • 10.4.2. Financials
      • 10.4.3. Product portfolio
      • 10.4.4. Business strategy
      • 10.4.5. Recent developments
    • 10.5. Taiwan Semiconductor Manufacturing Company, Ltd.
      • 10.5.1. Overview
      • 10.5.2. Financials
      • 10.5.3. Product portfolio
      • 10.5.4. Business strategy
      • 10.5.5. Recent developments
    • 10.6. Xilinx
      • 10.6.1. Overview
      • 10.6.2. Financials
      • 10.6.3. Product portfolio
      • 10.6.4. Business strategy
      • 10.6.5. Recent developments
    • 10.7. STMicroelectronics
      • 10.7.1. Overview
      • 10.7.2. Financials
      • 10.7.3. Product portfolio
      • 10.7.4. Business strategy
      • 10.7.5. Recent developments

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