Global Copper Clad Laminate Market size was valued at USD 18.2 Billion in 2023 and is expected to reach USD 30.4 Billion by 2032, at a CAGR of 5.7% during the forecast period 2023 – 2032.
Copper Clad Laminate Market – Overview
Copper Clad Laminate (CCL), a vital element in printed circuit board manufacturing, is extensively employed to create the foundational framework for electronic devices. It is widely utilized in the production of circuit boards, which serve as the fundamental framework for electronic devices.
CCL is a material made by impregnating resin with electronic glass fiber or other reinforcing materials, and it features a layer of copper on one or both sides.
Global trends in the copper clad laminate (CCL) market indicate a surge driven by the rising demand for electronic devices. Increased adoption of advanced technologies, such as 5G, IoT, and electric vehicles, propels the need for high-performance PCBs, boosting the CCL market.
Sustainability considerations are also influencing the industry, with a focus on eco-friendly materials. The growing emphasis on miniaturization and high-speed electronic applications further shapes the market dynamics, fostering innovations in CCL manufacturing processes to meet evolving industry requirements for compact, efficient, and reliable electronic components.
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By type, the rigid segment held the highest market share in 2022 and is expected to keep its dominance during the forecast period 2024-2032. Rising demand for rigid-type electronic applications is driving the copper clad laminate (CCL) market. The increasing trend toward miniaturization and high-performance requirements in electronic devices fuels the demand for rigid CCL.
Additionally, advancements in materials and manufacturing technologies, enabling enhanced thermal performance and electrical conductivity in rigid-type CCLs, further propel market growth.
By material, the epoxy segment held the highest market share in 2022 and is expected to keep its dominance during the forecast period 2024-2032. Emerging trends in epoxy are propelling the copper clad laminate (CCL) market, with a focus on advanced formulations. Epoxy resins with enhanced thermal stability and dielectric properties are in demand, meeting the evolving requirements of high-performance electronic devices.
CMI has comprehensively analyzed copper clad laminate market. The driving forces, restraints, challenges, opportunities, and key trends have been explained in depth to depict in depth scenario of the market. Segment wise market size and market share during the forecast period are duly addressed to portray the probable picture of this copper clad laminate industry.
The competitive landscape includes key innovators, after market service providers, market giants as well as niche players are studied and analyzed extensively concerning their strengths, weaknesses as well as value addition prospects. In addition, this report covers key players profiling, market shares, mergers and acquisitions, consequent market fragmentation, new trends and dynamics in partnerships.
List of the prominent players in the Copper Clad Laminate Market:
- Guangdong Chaohua Technology Co. Ltd.
- Taiwan Union Technology Corporation
- NAN YA Plastics Industrial Co. Ltd.
- Shandong Jinbao Electronics Co. Ltd.
- Sytech Technology Co. Ltd.
- Panasonic Corporation
- Cipel Italia
- Doosan Corporation
- Kingboard Laminates Holdings Ltd.
- Shengyi Technology Co. Ltd.
- National Metalized Sheets
- Sumitomo Chemical Company Limited
- Isola Group
- ITEQ Corporation
- Park Electrochemical Corp.
- DXC Technology Co. Ltd.
- Fujifilm Electronic Materials Co. Ltd.
- Ventec International Corporation
- Ibiden Co. Ltd.
- Taiwan Elite Material Co. Ltd
- Others
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